硅脂被证实为 Ivy Bridge 过热的罪魁祸首

景行厅男孩

链接：
http://www.techpowerup.com/165882/TIM-is-Behind-Ivy-Bridge-Temperatures-After-All.html
http://pc.watch.impress.co.jp/docs/column/sebuncha/20120511_532119.html

日本 PC Watch 证实了 Ivy Bridge 核心连接铁盖的硅脂是导致过热的罪魁祸首。
该网站把铁盖掀开，换了高效的硅脂之后，默认频率和超频下温度分别降低了 18% 和 23%。
而且换了硅脂之后，因为可以固定更高的电压，超频能力也变强了。
该测试证实了英特尔以硅脂替换焊接铁盖的决定，对温度和超频带来了非常显著的负面影响。

TIM is Behind Ivy Bridge Temperatures After All

It's proven: the thermal inte**ce material (TIM) used by Intel, inside the integrated heatspreader (IHS) of its Core "Ivy Bridge" processors are behind its higher than expected load temperatures. This assertion was first made in late-April by an Overclockers.com report, and was recently put to test by Japanese tech portal PC Watch, in which an investigator carefully removed the IHS of a Core i7-3770K processor, removed the included TIM and binding grease, and replaced them with a pair of aftermarket performance TIMs, such as OCZ Freeze and Coolaboratory Liquid Pro.

PC Watch findings show that swapping the TIM, if done right, can shave stock clock (3.5 GHz, Auto voltage) temperatures by as much as 18% (lowest temperatures by the Coolaboratory TIM), and 4.00 GHz @ 1.2V temperatures by as much as 23% (again, lowest temperatures on the Coolaboratory TIM). The change in TIM was also change the overclockability of the chip, which was then able to sustain higher core voltages to facilitate higher core clock speeds. The report concluded that Intel's decision to use thermal paste inside the IHS of its Ivy Bridge chips, instead of fluxless solder, poses a very real impact on temperatures and overclockability.